Socionext Inc. announced today that it will use Intel’s 18A-P process technology to develop custom system-on-chip (SoC) solutions targeting datacenter, edge, and high-performance computing customers. The company’s first development on the node will be a high-performance compute chiplet.
According to the official press release, Socionext will combine its ASIC design expertise with Intel Foundry’s advanced process and packaging roadmap. The goal is to deliver differentiated SoCs optimized for application-specific workloads.
Rajinder Cheema, CTO and Executive Vice President at Socionext, stated:
“Intel 18A-P represents an important step in advanced process technology, combining innovations in transistor architecture and power delivery. By developing SoC capabilities on this process, Socionext is enabling our customers to address the evolving performance and power requirements of AI, HPC, and advanced datacenter applications.”
John Zucker, General Manager and Vice President of Global Business Development and Marketing at Intel Foundry, added:
“The combination of Socionext’s Solution SoC development methodology and Intel Foundry’s advanced process and packaging technologies enriches the ecosystem for enabling product development for AI acceleration, high-performance compute, and Physical AI. Together we accelerate our customers’ time-to-market from architecture to production.”
The announcement positions the collaboration around AI acceleration, high-performance compute, edge applications, and Physical AI workloads, with an explicit focus on performance and power efficiency requirements.